1.High performance,large-scale output in a short period of time soldering and desoldering the IC below 45×35mm ,temperature can be Continuous adjusted high or low.you can also use T862D+ dolsering or desoldering directly on wide raers IC.it can be used for all kinds of components ,such as QFP,SOP,PLCC,SOJ Chips,especially Micro BGA chips in mobile phone and laptops mainboard. 2.Infraed heating without hot air flow will not effect on the components which nearby the IC you wanna repairing ,this will prevent the soldering or desoldering applicable to all components.Use Zero-crossing control technology,so the infrared Heat lamps filcker-free,pretect users , also extending theinfrared lamp's working time . 3.Permeadility strong,uniform heating,pre-heat area and the infrared lamp can work at the same time,ensure uniform heating and avoid the circuit board and component deformation.especially for desoldering the Sealing device components on the PCB,unique and convenient 4.to adapt different work ,Hot air gun can be adjusted on 32 kinds air volume ,;Silicone follow-up on the handle of hot air gun ,make user feel better,soldering lron bulit in high-power heating elements,Fast Temperature rise up. 5.Thermal fan only start working while per-heat area and infrared lamp working ,no voice and save energy. 6.For plastic closures IC ,you can pre-heat the PCB on the per heater first ,than heating the IC. 7.Taiwan-controlled warm-up adhoc,first of warm-up poweras awhole Board,and then heating IC(for plastic closures IC) have special groove for PCB stent,make PCB folder easier. circuit board.infrared lamp lens made from Quartz galss ,no danger from bursting.
BEST T862D+ Infrared BGA Rework Station
Total power consumption: 220V/1200W Input voltage: 220V/110V Operating temperature range: 100 degrees -450 degrees (whole, respectively) Size: 26 * 33.5 * 45.5mm Weight: 11KG